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The Center for Materials in Extreme Dynamic Environments (CMEDE) is pleased to announce its first annual MEDE Undergraduate Internship Program (MUIP). 

2014 MEDE Undergraduate Internship Program (MUIP) Awardees
Student and Home Institution Internship Host and MEDE PI
Reid Bremble, University of Delaware University of Delaware, Dr. Jack Gillespie
Franklin Houck, Rutgers University Rutgers University, Dr. Rich Haber
Ben Long, New Mexico Institute of Mining and Technology Johns Hopkins University, Dr. Kevin Hemker
Yitzi Snow, Johns Hopkins University Johns Hopkins University, Dr. Robert Cammarata
Andrew Tsai, Johns Hopkins University California Institute of Technology, Dr. Julia Greer

Program Details

This program provides funding for selected undergraduates to work with MEDE Principal Investigators at any of the participating research universities, the Army Research Laboratory, or other organizations listed below. In addition to the research experiences and knowledge gained through this program, MUIP students will have the opportunity to develop invaluable connections with practicing scientists and engineers. They will build networks and relationships that will provide job opportunities with the companies and access to graduate degree programs at the participating institutions.


Eligible applicants are current undergraduates at MEDE Consortium Institutions.

Award Amounts

The intent of the funding is to cover the undergraduate’s salary during the internship which should be approximately 2 – 3 months and at a wage rate consistent with the respective academic institution’s policies.  It is anticipated that the majority of these internships would occur during the summer of 2014, however applications will be accepted for internships that occur during the traditional academic semester.  The internship should be completed in calendar year 2014.

Application Format

  1. Name of applicant, institution, and contact information
  2. Top 3 desired locations for internship, approximate dates, name and contact information of MEDE Consortium Principle Investigator (PI) that you would like to work with.  A listing of the MEDE PIs is located under the Collaborative Materials Research Groups  (
  3. A short description of research areas of interest
  4. A curriculum vitae or resume of the applicant
  5. A scanned copy of the applicant’s academic transcript at their current institution

Deadlines and Evaluations

Applications are due by 5 p.m. Tuesday April 1, 2014.  Please email the application as a single PDF document to the CMEDE Research Service Manager, Phyllis Sevik (  The applications will be evaluated by a CMEDE committee that will make recommendations to the CMEDE Director.  Notification of awards is anticipated by the end of April 2014.  Funding for the awardee will be distributed into the home institution MEDE Consortium PI’s account for execution purposes.

If you have any questions please contact Phyllis Sevik (


Participating MEDE Consortium Universities and Organizations

MEDE Undergraduate Internships can be coordinated at:

• Johns Hopkins University, Baltimore, MD

• Army Research Laboratory, Aberdeen Proving Ground, MD

• Rutgers University, Piscataway, NJ

• University of Delaware, Newark, DE

• Drexel University, Philadelphia, PA

• Purdue University, West Lafayette, IN

• California Institute of Technology, Pasadena, CA

• University of California, Santa Barbara, Santa Barbara, CA

• Washington State University, Pullman, WA

• University of Texas at San Antonio, San Antonio, TX

• New Mexico Institute of Technology, Socorro, NM

• Johns Hopkins Applied Physics Laboratory, Laurel, MD

• Lawrence Livermore National Lab, Livermore, CA

• Southwest Research Institute, San Antonio, TX

• Ernst Mach Institut, Freiburg, Germany

Research Areas of Interest

Research areas of interest to the MUIP include, but are not limited to, the following:

• Impact science

• Structures under extreme loading

• Lightweight metals for vehicles

• Computational sciences

• Data science, visualization and data mining

• Computational mechanics

• Advanced manufacturing processes

• Materials science and engineering

• Mechanics of materials

• Molecular dynamics and atomistic simulations

• High energy density physics

• Design of interactive computing environments

• Polymers for extreme environments

• Design of extremely strong fibers

• Development of advanced ceramics

• Composite materials for impact applications

• Topology optimization for composites

• Multiscale materials research

• Measurements at sub-microsecond timescales

• In situ measurement technologies


The 2014 deadline has passed

Questions & Submissions

Contact Phyllis Sevik at