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The Center for Materials in Extreme Dynamic Environments (CMEDE) is pleased to announce its second annual MEDE Undergraduate Internship Program. 

2015 MEDE Undergraduate Internship Program (MUIP) Awardees
Student and Home Institution Internship Host and MEDE PI
Hayley Austin, Johns Hopkins University Johns Hopkins University, Dr. Mark Robbins
Moriah Bischann, California Institute of Technology California Institute of Technology, Dr. Guruswami Ravichandran
Daniel Chung, Rutgers University Rutgers University, Dr. Rich Haber
Austin Cruz, Rutgers University Rutgers University, Dr. Rich Haber
Andrew Han, Johns Hopkins University California Institute of Technology, Dr. Dennis Kochmann
Evan Martz, University of Delaware University of Delaware, Dr. Jack Gillespie

Program Details

The Center for Material in Extreme Dynamic Environments (MEDE) provides funding for selected students to work with MEDE Principal Investigators at participating universities, the Army Research Laboratory or other research institutes listed below.

The internship covers the student’s salary at a wage consistent with respective institution’s policies. The length of the internship is approximately 2-3 months. It is anticipated that the majority of these internships would occur during the summer of 2015, however applications will be accepted for internships that occur during the traditional academic semester.  The internship should be completed in calendar year 2015.

Eligibility

Eligible applicants are current undergraduates at MEDE Consortium Institutions.

Application Format

  1. Name of applicant, institution, and contact information
  2. Top 3 desired locations for internship, approximate dates, name and contact information of MEDE Consortium Principle Investigator (PI) that you would like to work with.  A listing of the MEDE PIs is located HERE.
  3. A short description of research areas of interest
  4. A curriculum vitae or resume of the applicant
  5. A scanned copy of the applicant’s academic transcript at their current institution

Deadlines and Evaluations

Applications are due by 5 p.m. Friday, February 13, 2015.  Please email the application as a single PDF document to the CMEDE Research Service Manager, Phyllis Sevik (psevik@jhu.edu).  The applications will be evaluated by a CMEDE committee that will make recommendations to the CMEDE Director.  Notification of awards is anticipated by the end of March 2015.

If you have any questions please contact Phyllis Sevik (psevik@jhu.edu).

Participating MEDE Consortium Universities and Organizations

• Johns Hopkins University, Baltimore, MD

• Army Research Laboratory, Aberdeen Proving Ground, MD

• Rutgers University, Piscataway, NJ

• University of Delaware, Newark, DE

• Drexel University, Philadelphia, PA

• Purdue University, West Lafayette, IN

• California Institute of Technology, Pasadena, CA

• University of California, Santa Barbara, Santa Barbara, CA

• Washington State University, Pullman, WA

• New Mexico Institute of Technology, Socorro, NM

• Lawrence Livermore National Lab, Livermore, CA

• Southwest Research Institute, San Antonio, TX

• Ernst Mach Institut, Freiburg, Germany

Research Areas of Interest include but are not limited to:

• Impact science

• Structures under extreme loading

• Lightweight metals for vehicles

• Computational sciences

• Data science, visualization and data mining

• Computational mechanics

• Advanced manufacturing processes

• Materials science and engineering

• Mechanics of materials

• Molecular dynamics and atomistic simulations

• High energy density physics

• Design of interactive computing environments

• Polymers for extreme environments

• Design of extremely strong fibers

• Development of advanced ceramics

• Composite materials for impact applications

• Topology optimization for composites

• Multiscale materials research

• Measurements at sub-microsecond timescales

• In situ measurement technologies

Deadline

February 13, 2015

Questions & Submissions

Contact Phyllis Sevik at psevik@jhu.edu.

Past MEDE Undergraduate Internship Program

Archive: MUIP 2014