Artificial Intelligence for Materials (MEDE+ AI-M)
On September 30, 2020, the U.S. Army established a new cooperative agreement with the Hopkins Extreme Materials Institute (HEMI) at Johns Hopkins University. The agreement, titled “Materials in Extreme Dynamic Environments Plus (MEDE+)” enables collaborative research activities between the DEVCOM U.S. Army Research Laboratory and HEMI. The initial set of projects will be focused on artificial intelligence for materials (AI-M). These projects will accelerate material development for Army’s emerging needs by integrating artificial intelligence and machine learning into materials science.
Projects & Key Personnel
Prof. KT Ramesh, Recipient Program Manager
Dr. Sikhanda Satapathy, Cooperative Agreement Manager
- Project 1 – Using artificial intelligence to accelerate the iterative materials design cycle by high-throughput microstructural characterization and rapid processing
- PI: Prof. Mark Foster
- Co-PIs: Prof. Todd Hufnagel, Prof. Tim Mueller, and Prof. Tim Weihs
- Project 2 – Acoustic signature and reconstruction of defect avalanches in metals
- PI: Prof. Jaafar El-Awady
- Co-PI: Prof Tamer Zaki
- Project 3 – Real-time monitoring of laser-material interactions
- PI: Dr. Steven Storck
- Co-PIs: Prof. Mark Foster and Dr. Morgan Trexler
- Project 4 – Toward self-repairing devices: Data-directed design of active, hierarchical colloidal assembly and reconfiguration
- PI: Prof. Rebecca Schulman
- Co-PI: Prof. Yannis Kevrekidis
For additional information, please contact Katie Vaught at firstname.lastname@example.org.
Research was sponsored by the Army Research Laboratory and was accomplished under Cooperative Agreement Number W911NF-20-2-0281. The views and conclusions contained in this document are those of the authors and should not be interpreted as representing the official policies, either expressed or implied, of the Army Research Laboratory or the U.S. Government. The U.S. Government is authorized to reproduce and distribute reprints for Government purposes notwithstanding any copyright notation herein.