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HEMI Short Course: Experimental Methods for High Strain Rates, Prof. KT Ramesh

March 29 @ 8:00 am - 5:00 pm

|Recurring Event (See all)

An event every day that begins at 8:00am, repeating until March 30, 2018

Instructor: Prof. K.T Ramesh (Alonzo G. Decker Jr. Professor of Science & Engineering Director, Hopkins Extreme Materials Institute, Professor, Departments of Mechanical Engineering, Earth and Planetary Sciences, Materials Science and Engineering Johns Hopkins University)

Location: Johns Hopkins University, Homewood Campus, Baltimore, MD

About the course:

This two-day short course will provide an overview of modern experimental methods for the characterization of the high strain rate deformation of materials, including metals, ceramics, geomaterials, polymers and composites. The first half of the course will provide a survey of the fundamental theory associated with high strain rate experimentation, while the second half of the course will focus on the manifestation of that theory through the major experimental methods in the laboratory. The course will demonstrate some of these experimental methods through hands-on exercises. A significant emphasis will be on the associated instrumentation and data analysis.

About the instructor:

Professor K.T. Ramesh received his doctorate from Brown University in 1987 and worked briefly as a postdoctoral fellow at the University of California, San Diego. He joined the Department of Mechanical Engineering at Johns Hopkins in 1988 and served as the Department Chair from 1999-2002. He has served as founding Director of HEMI since 2012. His research interests are in high strain rate behavior and dynamic failure of materials, nanostructured materials, injury biomechanics and planetary scale impact problems. He has published one book (Nanomaterials: Mechanics and Mechanisms; Springer) and threatens to write another. He is an avid amateur astronomer.

More details and registration details can be found by visiting https://hemi.jhu.edu/experimental-methods-high-strain-rates/.