Announcing the HEMI/APL Seed Grant Opportunity

Nov 26, 2019 | No Comments | By Michelle Pagano

The Hopkins Extreme Materials Institute (HEMI) and the Johns Hopkins Applied Physics Laboratory (APL) are pleased to announce our first HEMI/APL collaborative seed grant
program. The goal of this program is to provide seed funding with the intent of bringing together scientists and engineers from HEMI and APL to collaborate on research topics of
mutual interest.

While all directions related to the HEMI mission will be considered, directions of particular interest are topics that emerged from the joint, HEMI/APL collaboration meeting
held at APL on May 17, 2019. These topics include:

  • Hypersonics
    • Surface Roughness Effects under Hypersonic Flight Conditions
    • Sensing in Hypersonic Environments
    • Characterization, including Hyperspectral Imaging, of Thermal Spray/HVOF
    • High Temperature Gas Gun Capability Development
  • Additive Manufacturing
    • Effects of Shielding Gases
    • Hyperspectral Imaging of AM Processing
  • Armor and High Rate Impact
    • High Rate Mechanical Behavior/Mechanisms of AM Metal Matrix Composites
    • Shear Bands in Tungsten
    • Design and Optimization of Transparent Armor Materials
    • Modeling of UHMWPE Helmets
    • High Rate Characterization and Modeling of Mechanophoric Gels
    • Skull Characterization and Testing
    • Tissue/Organ Modeling

Proposal submissions are due by 5 p.m. on Monday, January 20, 2020. Please email the proposal as a single PDF document and the budget/budget justification in Excel to [email protected].

For more information on the award, eligibility requirements, and proposal format, click here.

Comments are closed.